PX-119 is a solvent-free, hot-curing 2-part IPN adhesive based on epoxy resins with high media and temperature resistance. It does not contain fillers.
PX-119 is suitable for high-temperature resistant structural bonding of metals, glass, and ceramics. Good bond strength is also obtained to polyester.
2 separated components A + B, each in polyethylene containers. Available package sizes: 30, 60, 120, 240, 500 and 1000 g as well as 50 mL Mixpac™ cartridges.
| Property | Method | Conditions | Value |
|---|---|---|---|
| Viscosity at RT | 23 °C | medium | |
| Pot Life at RT | 23 °C | 24 h | |
| Pot Life at 60°C | 60 °C | 30 min | |
| Reaction Enthalpy | DSC | 10 K/min | 351 J/g |
| Temperature in Reaction Maximum | DSC | 10 K/min | 124 °C |
| Colour (cured) | light amber / translucent | ||
| Decomposition Temperature under N2 | TGA | 10 K/min | 395 °C |
| Glass Transition Temperature | DSC | 10 K/min | 120 °C |
| Thermal Expansion | DMA-TMA | 2 K/min, 30–50 °C | 26 · 10−6 K−1 |
| 2 K/min, 50–70 °C | 45 · 10−6 K−1 | ||
| 2 K/min, 170–200 °C | 158 · 10−6 K−1 | ||
| Resistance to Acids | Storage Test in Acids | good | |
| Resistance to Bases | Storage Test in Bases | good |
| Substrate | Pretreatment | Test Temperature [°C] | ||
|---|---|---|---|---|
| 23 | 160 | 220 | ||
| Aluminium AlCuMg1 | degreased (Acetone) | 8.5 | 2.0 | |
| Aluminium AlCuMg1 | roughened with sandpaper, degreased | 15.8 | 3.1 | 1.6 |
| Aluminium AlCuMg1 | DIN 53281 (etched) | 16.7 | 11.9 | 3.4 |
| Aluminium AlMg1 | DIN 53281 (etched) | 14.5 | 5.3 | |
| Stainless Steel 1.4301 | etched | 19.0 | 14.4 | 3.9 |
A : B = 2 : 1 (weight)
Using separated components: Prepare 1 part of component B and mix carefully with 2 parts of component A. In order to decrease viscosity the mixture can be heated to 60 °C at the cost of shortened pot life. After mixing the adhesive can be applied to the prepared bonding surface and then must be cured at elevated temperatures
Using Mixpac™ cartridges: Insert the cartridge in the applicator which must be equipped with a 2 : 1 plunger. Insert the static mixer. Discard the first 5 cm of adhesive from the mixer. Subsequent adhesive is thoroughly mixed and ready to use.
Curing should be conducted in two temperature steps at 80 and 130 °C. The duration of each step mainly depends on how quick the neccessary temperature can be reached in the adhesive layer. Small and thin substrates with good thermal conductivity can be cured quickly. Larger structures and substrates with low thermal conductivity should be cured for longer periods.
As a starting point a curing schedule of 1 h at 80 °C + 2 h at 130 °C should be tested. Suitable tests under real-life conditions should be conducted by the user.
Spare amounts of the adhesive should be cured and then disposed of according to local regulations.
PX-119 (A+B) should be stored in its original container in a refrigerator at 8–12°C (do not freeze). Avoid direct sunlight. Shelf life is 6 months. Storage date is given on each container.
When using the adhesive wear protective glasses and gloves. Refer to further instructions in the Material Safety Data Sheet.
All recommendations for use of our products, whether given by us in writing, verbally, or to be implied from the results of tests carried out by us, are based on the current state of our knowledge. Notwithstanding any such recommendations the Buyer shall remain responsible for satisfying himself that the products as supplied by us are suitable for his intended process or purpose. Since we cannot control the application, use or processing of the products, we cannot accept responsibility therefor. The Buyer shall ensure that the intended use of the products will not infringe any third party's intellectual property rights. We warrant that our products are free from defects in accordance with and subject to our general conditions of supply.
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