PolymericsSpecialty Polymers • Adhesives • Polymer Characterization

Technical Data Sheet PX-103

Description

PX-103 is a solvent-free, hot-curing 2-part IPN adhesive based on epoxy resins with high media and temperature resistance. It is a toughened (flexibilized) adhesive and does not contain fillers.

PX-103 is suitable for high-temperature resistant structural bonding of metals, glass, and ceramics. It is especially intended for stainless steel and aluminium.

Packaging

2 separated components A + B, each in polyethylene containers. Available package sizes: 30, 60, 120, 240, 500 and 1000 g.

Properties

PropertyMethodConditionsValue
Viscosity at RT 23 °Cmedium to high
Pot Life at RT 23 °C5 h
Reaction EnthalpyDSC10 K/min275 J/g
Temperature in Reaction MaximumDSC10 K/min131 °C
Colour (cured)  light amber / translucent
Decomposition Temperature under N2TGA10 K/min384 °C
Glass Transition TemperatureDSC10 K/min104 °C
Thermal ExpansionDMA-TMA2 K/min, 30–50 °C44 · 10−6 K−1
2 K/min, 50–70 °C62 · 10−6 K−1
2 K/min, 170–200 °C161 · 10−6 K−1

Adhesive Strength

Tensile Shear Strength [MPa] according to DIN EN 1465, 5 mm/min
SubstratePretreatmentTest Temperature [°C]
23160220
Aluminium AlCuMg1DIN 53281 24.6 8.8 3.3
Stainless Steel 1.4301etched 23.7 9.5 2.9
Steel ST 1403none (as received with oil on surface) 18.7 1.5  

Mixing Ratio

A : B = 1 : 1 (weight)

Processing

Prepare 1 part of component B and mix carefully with 1 part of component A. In order to decrease viscosity the mixture can be heated to 60 °C at the cost of shortened pot life. After mixing the adhesive can be applied to the prepared bonding surface and then must be cured at elevated temperatures

Note: On stainless steel higher adhesive strength can be achieved if a mixing ratio of A : B = 6 : 5 is used instead of 1 : 1 (RT: 23.6 MPa; 160 °C: 10.1 MPa; 220 °C: 3.8 MPa).

Curing

Curing should be conducted in two temperature steps at 80 and 130 °C. The duration of each step mainly depends on how quick the neccessary temperature can be reached in the adhesive layer. Small and thin substrates with good thermal conductivity can be cured quickly. Larger structures and substrates with low thermal conductivity should be cured for longer periods.

As a starting point a curing schedule of 1 h at 80 °C + 2 h at 130 °C should be tested. Suitable tests under real-life conditions should be conducted by the user.

Disposal

Spare amounts of the adhesive should be cured and then disposed of according to local regulations.

Storage

PX-103 (A+B) should be stored in its original container in a refrigerator at 8–12°C (do not freeze). Avoid direct sunlight. Shelf life is 6 months. Storage date is given on each container.

Security / Handling Precautions

When using the adhesive wear protective glasses and gloves. Refer to further instructions in the Material Safety Data Sheet.

All recommendations for use of our products, whether given by us in writing, verbally, or to be implied from the results of tests carried out by us, are based on the current state of our knowledge. Notwithstanding any such recommendations the Buyer shall remain responsible for satisfying himself that the products as supplied by us are suitable for his intended process or purpose. Since we cannot control the application, use or processing of the products, we cannot accept responsibility therefor. The Buyer shall ensure that the intended use of the products will not infringe any third party's intellectual property rights. We warrant that our products are free from defects in accordance with and subject to our general conditions of supply.

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