PX-101 is a solvent-free, hot-curing 2-part IPN adhesive based on epoxy resins with high media and temperature resistance. It does not contain fillers.
PX-101 is suitable for high-temperature resistant structural bonding of metals, glass, and ceramics. This adhesive can be used to achieve vacuum tight bonds and it shows remarkably constant adhesive strength on untreated, oily steel up to 160 °C.
2 separated components A + B, each in polyethylene containers. Available package sizes: 30, 60, 120, 240, 500 and 1000 g.
| Property | Method | Conditions | Value |
|---|---|---|---|
| Viscosity at RT | 23 °C | medium to low | |
| Viscosity at RT | ARES Rheometer | 60 °C, plate/plate | 0.277 Pa·s |
| Pot Life at RT | 23 °C | ca. 5 h | |
| Pot Life at 60°C | 60 °C | ca. 30 min | |
| Reaction Enthalpy | DSC | 10 K/min | 549 J/g |
| Temperature in Reaction Maximum | DSC | 10 K/min | 97, 159, and 260 °C |
| Colour (cured) | dark amber / translucent | ||
| Decomposition Temperature under N2 | TGA | 10 K/min | 298 °C |
| Glass Transition Temperature | DSC | 10 K/min | 70 °C |
| Thermal Expansion | DMA-TMA | 2 K/min, 30–50 °C | 33 · 10−6 K−1 |
| 2 K/min, 50–70 °C | 133 · 10−6 K−1 | ||
| 2 K/min, 170–200 °C | 1778 · 10−6 K−1 |
| Substrate | Pretreatment | Test Temperature [°C] | ||
|---|---|---|---|---|
| 23 | 160 | 220 | ||
| Aluminium AlCuMg1 | DIN 53281 | 14.0 | 10.3 | 3.6 |
| Stainless Steel 1.4301 | etched | 10.1 | 11.9 | 3.3 |
| Steel ST 1403 | none (as received with oil on surface) | 8.8 | 8.8 | |
A : B = 1 : 1 (weight)
Prepare 1 part of component A and mix carefully with 1 part of component B. In general, no additional heating is required for the mixing.
For making vacuum tight bonds the adhesive must be freed from air bubbles introduced during the mixing. This can be easiliy achieved by evacuating the adhesive before application. Depending on the introduced amount of air the adhesive will at first create more or less foam which later collapses.
After mixing and possibly evacuating the adhesive should be immediatly applied to the bond surface and then cured.
Curing should be conducted in two temperature steps at 80 and 130 °C. The duration of each step mainly depends on how quick the neccessary temperature can be reached in the adhesive layer. Small and thin substrates with good thermal conductivity can be cured quickly. Larger structures and substrates with low thermal conductivity should be cured for longer periods.
As a starting point a curing schedule of 1 h at 80 °C + 2 h at 130 °C should be tested. Suitable tests under real-life conditions should be conducted by the user.
Note that this adhesive exhibits anaerobic properties. In contact with air it will only cure at temperatures as high as 180 or 200 °C. In the bond line however, 80 to 130 °C are sufficient since there is no air/oxygen present there. Uncured adhesive traces outside the bond line can be therefore removed by wiping with a solvent such as acetone after the curing.
Spare amounts of the adhesive should be cured and then disposed of according to local regulations.
PX-101 (A+B) should be stored in its original container in a refrigerator at 8–12°C (do not freeze). Avoid direct sunlight. Shelf life is 6 months. Storage date is given on each container.
When using the adhesive wear protective glasses and gloves. Refer to further instructions in the Material Safety Data Sheet.
All recommendations for use of our products, whether given by us in writing, verbally, or to be implied from the results of tests carried out by us, are based on the current state of our knowledge. Notwithstanding any such recommendations the Buyer shall remain responsible for satisfying himself that the products as supplied by us are suitable for his intended process or purpose. Since we cannot control the application, use or processing of the products, we cannot accept responsibility therefor. The Buyer shall ensure that the intended use of the products will not infringe any third party's intellectual property rights. We warrant that our products are free from defects in accordance with and subject to our general conditions of supply.
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