PX-309 is a solvent-free, hot-curing, 1-part bismaleimide adhesive with high media and temperature resistance. This adhesive does not contain fillers and it is suitable for high-temperature resistant structural bonding of metals, glass, and ceramics. It is characterized by very stable properties in the temperature range between room temperature (23 °C) and 220 °C. PX-309 is especially suitable for long-term high-temperature applications and it is very resistant to many organic solvents.
PX-309 is very resistant to hydrolysis, making it the adhesive of choice for joining parts in sterilizable equipment.
Medium to low viscous paste available in polyethylene containers of 25, 50, 100 and 500 g.
| Property | Method | Conditions | Value |
|---|---|---|---|
| Viscosity at RT | 23 °C | medium to low | |
| Viscosity at 60 °C | ARES Rheometer | plate/plate, 60 °C, 1 Hz | 24 Pa·s |
| Solubility (not cured) | 23 °C | soluble in chlorinated solvents, about 5% soluble in acetone | |
| Melting Range | 70–90 °C | ||
| Pot Life | 23 °C | > 6 months | |
| 60 °C | ca. 1 h | ||
| Reaction Enthalpy | DSC | 10 K/min | 244 J/g |
| Temperature in Reaction Maximum | DSC | 10 K/min | 171 °C |
| Colour (not cured) | orange-yellow / opaque | ||
| Colour (cured) | amber / translucent | ||
| Decomposition Temperature under N2 | TGA | 10 K/min, T(Δm 5 %) | 411 °C |
| Glass Transition Temperature | DMA-SC | 3 K/min, 1 Hz | 210 °C |
| Pencil Hardness | 6 H | ||
| Dwelling in Acetone | Storage in Acetone | 23 °C, 5 months | < 1 % |
| Thermal Expansion | DMA-TMA | 2 K/min, 30–50 °C | 18 · 10−6 K−1 |
| 2 K/min, 50–70 °C | 32 · 10−6 K−1 | ||
| 2 K/min, 170–200 °C | 91 · 10−6 K−1 | ||
| Resistance to Acids | Storage in Acids | good | |
| Resistance to Bases | Storage in Bases | good |
| Substrate | Pretreatment | Test Temperature [°C] | ||
|---|---|---|---|---|
| 23 | 160 | 220 | ||
| Aluminium AlCuMg1 | DIN 53281 | 8.3 | 9.1 | 6.9 |
| Stainless Steel 1.4301 | etched | 11.9 | 8.7 | 4.1 |
PX-309 should be prefereably applied to carefully degreased and pretreated surfaces. Best results are obtained when follwing the directions for surface pretreatments of various materials.
The PX-309 adhesive paste can be distributed on the substrate surface at room temperature using a spatula, glass sticks or similar tools. Slight heating to 30–40 °C promotes adhesive distribution on the surface.
When heating the adhesive to 70–90 °C it will become completely liquid so that it can be pulled into thin adhesive layers using capillary forces. Note that pot life of the adhesive will shorten the higher the temperature is.
PX-309 requires a curing temperature of 150 °C. Post curing at 200 °C improves the properties significantly and is recommended for achieving highest temperature and media resistance as well as thorough curing.
The curing duration depends on how fast the curing temperature can be realized in the bond range. Small and thin substrates with good thermal conductivity can be cured quickly. Larger structures and substrates with low thermal conductivity should be cured for longer periods.
As a starting point a curing shedule of 2 h at 150 °C should be testet. Post curing at 200 °C should also last 2 h. Suitable tests under real-life conditions should be conducted by the user.
Spare amounts of the adhesive should be cured and then disposed of according to local regulations.
PX-309 can be stored in its original container in a refrigirator between 4 and 12 °C (do not freeze!). Avoid direct sunlight. Shelf life is 6 months. Storage date is given on each container.
When using the adhesive wear protective glasses and gloves. Refer to further instructions in the Material Safety Data Sheet.
All recommendations for use of our products, whether given by us in writing, verbally, or to be implied from the results of tests carried out by us, are based on the current state of our knowledge. Notwithstanding any such recommendations the Buyer shall remain responsible for satisfying himself that the products as supplied by us are suitable for his intended process or purpose. Since we cannot control the application, use or processing of the products, we cannot accept responsibility therefor. The Buyer shall ensure that the intended use of the products will not infringe any third party's intellectual property rights. We warrant that our products are free from defects in accordance with and subject to our general conditions of supply.
© 1999-2002 Polymerics GmbH, last update: 2002-01-09 by webmaster@polymerics.de